Volume 21, Issue 55, January - June, 2024

Investigations on Microchannel Heat Exchanger using Numerical, Experimental, and ANN Techniques

Surendra Barhatte^1♦, Mandar Lele²

¹Research Scholar, Dr Vishwanath Karad MIT World Peace University, Pune, 411038, India
²Professor, Dr Vishwanath Karad MIT World Peace University, Pune, 411038, India

^♦Corresponding author
Research Scholar, Dr Vishwanath Karad MIT World Peace University, Pune, 411038, India

ABSTRACT

Thermal systems, such as high-performance vehicle radiators, require significant heat flux to be removed to maintain consistent performance and prolonged life. Microchannels offer a viable option because they provide a significant heat transfer area-to-volume ratio. The analytical design of a Microchannel heat exchanger (MCHX) with tiny fins above and below is part of the research work. A coolant with a temperature range of 75OC to 85OC and ambient air with a temperature range of 30OC to 35OC are used as test inputs for the MCHX. The estimated MCHX's size for these test inputs is consistent with a 3000 W heat duty. Compared to the Minichannel Hx (Heat Exchanger) for the same heat duty, the size is decreased by 60%. The estimated size is then subjected to numerical analysis using software tools. Analytical and numerical results are found to concur well with one another, with less than 9.64% variance. Regression, followed by common sense and uncertainty analysis, is then used to build the Nusselt- Prandtl (Nu-Pr) correlation with 0.9% of the calculated uncertainty, which helps increase the confidence in the results obtained. For predicting Nu value, an Artificial Neural Network (ANN) model is also created. The experimental Nu values and the values predicted by regression correlation are compared with the Nu values predicted by the ANN model, and it is shown that they are both within 3% of one another in variance.

Keywords: Microchannel, Numerical Analysis, Performance testing, Commonsense analysis, Uncertainty analysis, ANN model

Indian Journal of Engineering, 2024, 21(55), e7ije1682

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DOI: https://doi.org/10.54905/disssi.v21i55.e7ije1682

Published: 23 June 2024